Structure
Available Laminates
- Fr-4
- High Tg Fr-4
- Halogen Free Fr-4
- BT Resin
- Polyimide
Specifiction
| Item | Unit | Standard | Special | Remarks |
|---|---|---|---|---|
| Laser VIA Hole Size | ㎜ | 0.1 ~ 0.15 | 0.05 ~ 0.1 | - |
| Total Thickness | ㎜ | 0.4 ~ 1.8 | 0.2 ~ 0.39, 1.81 ~ 6.4 | - |
| Thin Core Thickness | ㎜ | 0.2 ~ 1.8 | 0.03 ~ 0.15, 1.81 ~ 3.2 | - |
| Inner Layer Copper Thickness | ㎛ | 17, 35 | 70, 105, 140 | - |
| Layer Count | - | 4 ~ 12 | 14 ~ 32 | - |
| Inner Layer Line Width/Space | ㎛ | 100 ~ | 50 ~ 100 | - |
| Out Layer Line Width/Space | ㎛ | 125 ~ | 75 ~ 125 | - |
| Minimum Hole Size | ㎜ | 0.3 | 0.1 ~ 0.25 | - |
| Surface Treatment | - | OSP. HOT AIR SOLDER LOVELLING(PB-FREE) | FLASH GOLD IMMERSION TIN CARBON PASTE, PEELABLE COATING | - |